Hardware

19″ Case

ratiopacPRO / air

  • use ratiopacPRO-air when increased heat dissipation is needed
  • Pre-configured complete cases or case for individual assembly
  • EMC shielded versions, retrofittable EMC shielding
  • Symmetrical design, identical front and rear side
  • Flexible assemblies, prepared for 19″ components or
  • individual assembly, e. g. with chassis plate
  • Wide range of accessories, coordinated for mobile applications
  • Scratch-resistant finish through powder coating
  • No visible screws
  • Suitable for CompactPCI and VME64x applications
  • Simple conversion from desk-top case to 19″ subrack case and vice versa

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