CESCC820 – SWaP UltraScale Embedded System, Ruggedised and Conduction Cooled
SWaP Embedded System, Ruggedised and Conduction Cooled
*For an air-cooled version of this system please refer to the CES820
The CESCC820 (Compact Embedded System) is a ruggedized, small form factor embedded system designed to provide a complete and generic processing platform for data acquisition, signal processing, and communication. With Size, Weight, and Power (SWaP) in mind, the conduction-cooled CESCC820 features a low-power x86 CPU tightly coupled to a high-performance Kintex UltraScale FPGA and FPGA Mezzanine Card (FMC – VITA 57.1). The UltraScale FPGA provides a flexible and powerful processing backbone for interfacing to the FMC sites, CPU, and DDR3 SDRAM, with plenty of room left over for high-performance Digital Signal Processing needs.
The system is ideal as an embedded solution for demanding field deployment. FMCs can be chosen from 4DSP’s extensive portfolio or from a third-party vendor. The compact but robust CESCC820 provides high-performance embedded processing and computing with flexible IO in a compact footprint for demanding applications where SWaP requirements and durability are the primary concerns.
System IO
- Meritec Hercules general purpose IO connections (VITA 75)
- HDMI
- USB
- 1Gb Ethernet
- 2x 10Gb Ethernet (optional)
- JTAG
- FMC HPC site (see the 4DSP FMC portal)
- PCIe communication between processor and FPGA
Processor – System controller
- Intel Atom Quad Core 1.91 GHz Processor
- 2GB DDR3 SDRAM
- 64GB SSD (2x 64GB SSD option)
- Windows and Linux support
FPGA
- Kintex UltraScale XCKU040
- 4GB DDR3 SDRAM
- SDAccel support
Power
- DC 16V – 30V
- Optimized for battery/solar powered applications
Dimensions and Weight
- Enclosure base – 148mm x 163mm
- Enclosure body – 121mm x 163mm
- Height – 100mm
- Weight – 3.0 Kg
