Hardware

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CESCC820 – SWaP UltraScale Embedded System, Ruggedised and Conduction Cooled

SWaP Embedded System, Ruggedised and Conduction Cooled

*For an air-cooled version of this system please refer to the CES820

 

The CESCC820 (Compact Embedded System) is a ruggedized, small form factor embedded system designed to provide a complete and generic processing platform for data acquisition, signal processing, and communication. With Size, Weight, and Power (SWaP) in mind, the conduction-cooled CESCC820 features a low-power x86 CPU tightly coupled to a high-performance Kintex UltraScale FPGA and FPGA Mezzanine Card (FMC – VITA 57.1). The UltraScale FPGA provides a flexible and powerful processing backbone for interfacing to the FMC sites, CPU, and DDR3 SDRAM, with plenty of room left over for high-performance Digital Signal Processing needs.

 

The system is ideal as an embedded solution for demanding field deployment. FMCs can be chosen from 4DSP’s extensive portfolio or from a third-party vendor. The compact but robust CESCC820 provides high-performance embedded processing and computing with flexible IO in a compact footprint for demanding applications where SWaP requirements and durability are the primary concerns.

 

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System IO

  • Meritec Hercules general purpose IO connections (VITA 75)
    • HDMI
    • USB
    • 1Gb Ethernet
    • 2x 10Gb Ethernet (optional)
    • JTAG
  • FMC HPC site (see the 4DSP FMC portal)
  • PCIe communication between processor and FPGA

 

Processor – System controller

  • Intel Atom Quad Core 1.91 GHz Processor
  • 2GB DDR3 SDRAM
  • 64GB SSD (2x 64GB SSD option)
  • Windows and Linux support

 

FPGA

  • Kintex UltraScale XCKU040
  • 4GB DDR3 SDRAM
  • SDAccel support

 

Power

  • DC 16V – 30V
  • Optimized for battery/solar powered applications

 

Dimensions and Weight

  • Enclosure base – 148mm x 163mm
  • Enclosure body – 121mm x 163mm
  • Height – 100mm
  • Weight – 3.0 Kg

 

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